Trademark: SILANNA SAFE UV 2344136
Word
SILANNA SAFE UV
ID
2344136
Trademark Type
Word
Status
Registered: Registered/protected
Application Date
23 March 2023
Registration Date
23 March 2023
Renewal Date
23 March 2033
Owner(s)
Service
Davies Collison Cave Pty Ltd
Goods and Services:
Class 9:
Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; mechanisms for coin-operated apparatus; cash registers, calculating machines, fire-extinguishing apparatus; circuits; analog circuits; mixed signal and analog devices; high speed isolators; wide band receivers; low noise amplifiers; electronic circuits; electronic integrated circuits; electronic logic circuits; electronic memory circuits; hybrid circuits; hybrid integrated circuits; infrared circuit components; logic circuits; masks for making circuits; microprocessor control circuits; miniature circuit breakers; circuit breakers; circuit cards; circuit closers; circuit distributors; circuit fuses; circuit openers; circuit switches; circuit testers; circuits (electric or electronic); electronic chips (semi-conductors) for the manufacture of integrated circuits; integrated circuits; cards bearing integrated circuits; cards incorporating integrated circuits; cartridges with memory integrated circuits; chips (integrated circuits); electronic chips (semi-conductors) for the manufacture of integrated circuits; electronic integrated circuits; silicon on insulator wafers; glass wafers for integrated circuits; hybrid integrated circuits; integrated circuits; integrated circuits for networks for use in identification; masks for making integrated circuits; masks for the production of integrated circuits; photo mask substrates for integrated circuits; plates with integrated circuits; probes for use with integrated circuits (other than for medical use); reading machines for integrated circuits; silicon wafer carriers for handling integrated circuits; sockets for testing integrated circuits; solid-state integrated circuits; test probe assemblies for integrated circuits; test sockets for integrated circuits; thick film hybrid integrated circuits; integrated circuit memories; semi conductors; complementary metal-oxide semiconductors; compound semiconductors; semi conductor memories; semi conductor chips; semi conductor and microprocessor cartridges; semiconductor apparatus; semiconductor apparatus for use with computers; semiconductor devices; semiconductor elements; semiconductor instruments; semiconductor manufacturing apparatus; semiconductor memories being computer programmes; semiconductor memory apparatus; semiconductor memory cartridges being computer programmes; semiconductor memory devices; semiconductor memory instruments; semiconductor wafers; semiconductors (integrated circuits); semiconductors being electronic devices; silicon chips (electronic components); silicon controlled reactors; silicon controlled rectifiers; micro accelerometers; silicon micro accelerometers; silicon on insulator wafers; silicon rubber layered electrical connectors; silicon slices (wafers); silicon wafer carriers for handling integrated circuits; silicon wafer slices; silicon wafers; wafers (silicon slices); processors; microprocessors; microcontrollers; static RAM; digital logic circuits; equipment for testing and programming integrated circuits; catalyst substrates for use in signalling apparatus; flexible circuit substrates having controlled impedance characteristics; flexible printed circuits incorporating substrates; glass substrates; photomask substrates for integrated circuits; printed circuits on substrates of flexible film; printed circuits on substrates of plastics material; printed substrates for printed circuit boards; recording substrates (magnetic); recording substrates (optical); special glass carrier substrates for biologically significant substances; substrates (printed circuit boards) ready for etching; substrates (wafers); substrates for carrying information in electronic form; substrates for carrying information in magnetic form; substrates for carrying information in optical form; substrates for holographs; substrates for photographs (exposed); substrates for photographs (unexposed); apparatus for connecting electrical circuit components; apparatus for testing electronic circuits; apparatus for testing printed circuit boards; apparatus for the exposure of films for integrated circuits; light emitting diodes (LED); light emitting diodes (LED) for use in scientific and manufacturing equipment; light emitting diodes (LED) for high energy light; parts, fittings, accessories, components and testing apparatus for all the aforesaid goods
Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; mechanisms for coin-operated apparatus; cash registers, calculating machines, fire-extinguishing apparatus; circuits; analog circuits; mixed signal and analog devices; high speed isolators; wide band receivers; low noise amplifiers; electronic circuits; electronic integrated circuits; electronic logic circuits; electronic memory circuits; hybrid circuits; hybrid integrated circuits; infrared circuit components; logic circuits; masks for making circuits; microprocessor control circuits; miniature circuit breakers; circuit breakers; circuit cards; circuit closers; circuit distributors; circuit fuses; circuit openers; circuit switches; circuit testers; circuits (electric or electronic); electronic chips (semi-conductors) for the manufacture of integrated circuits; integrated circuits; cards bearing integrated circuits; cards incorporating integrated circuits; cartridges with memory integrated circuits; chips (integrated circuits); electronic chips (semi-conductors) for the manufacture of integrated circuits; electronic integrated circuits; silicon on insulator wafers; glass wafers for integrated circuits; hybrid integrated circuits; integrated circuits; integrated circuits for networks for use in identification; masks for making integrated circuits; masks for the production of integrated circuits; photo mask substrates for integrated circuits; plates with integrated circuits; probes for use with integrated circuits (other than for medical use); reading machines for integrated circuits; silicon wafer carriers for handling integrated circuits; sockets for testing integrated circuits; solid-state integrated circuits; test probe assemblies for integrated circuits; test sockets for integrated circuits; thick film hybrid integrated circuits; integrated circuit memories; semi conductors; complementary metal-oxide semiconductors; compound semiconductors; semi conductor memories; semi conductor chips; semi conductor and microprocessor cartridges; semiconductor apparatus; semiconductor apparatus for use with computers; semiconductor devices; semiconductor elements; semiconductor instruments; semiconductor manufacturing apparatus; semiconductor memories being computer programmes; semiconductor memory apparatus; semiconductor memory cartridges being computer programmes; semiconductor memory devices; semiconductor memory instruments; semiconductor wafers; semiconductors (integrated circuits); semiconductors being electronic devices; silicon chips (electronic components); silicon controlled reactors; silicon controlled rectifiers; micro accelerometers; silicon micro accelerometers; silicon on insulator wafers; silicon rubber layered electrical connectors; silicon slices (wafers); silicon wafer carriers for handling integrated circuits; silicon wafer slices; silicon wafers; wafers (silicon slices); processors; microprocessors; microcontrollers; static RAM; digital logic circuits; equipment for testing and programming integrated circuits; catalyst substrates for use in signalling apparatus; flexible circuit substrates having controlled impedance characteristics; flexible printed circuits incorporating substrates; glass substrates; photomask substrates for integrated circuits; printed circuits on substrates of flexible film; printed circuits on substrates of plastics material; printed substrates for printed circuit boards; recording substrates (magnetic); recording substrates (optical); special glass carrier substrates for biologically significant substances; substrates (printed circuit boards) ready for etching; substrates (wafers); substrates for carrying information in electronic form; substrates for carrying information in magnetic form; substrates for carrying information in optical form; substrates for holographs; substrates for photographs (exposed); substrates for photographs (unexposed); apparatus for connecting electrical circuit components; apparatus for testing electronic circuits; apparatus for testing printed circuit boards; apparatus for the exposure of films for integrated circuits; light emitting diodes (LED); light emitting diodes (LED) for use in scientific and manufacturing equipment; light emitting diodes (LED) for high energy light; parts, fittings, accessories, components and testing apparatus for all the aforesaid goods
Class 40:
Customised materials assembly for others; custom manufacture of chips; custom manufacture of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; custom manufacture services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the custom manufacture of semiconductor materials and devices; foundry services related to design of light emitting diodes (LED); consultancy, assistance, advisory and information services (including online, interactive, digital and datacasting services) in relation to the foregoing
Customised materials assembly for others; custom manufacture of chips; custom manufacture of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; custom manufacture services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the custom manufacture of semiconductor materials and devices; foundry services related to design of light emitting diodes (LED); consultancy, assistance, advisory and information services (including online, interactive, digital and datacasting services) in relation to the foregoing
Class 42:
Scientific and technological services and research and design relating thereto; industrial analysis and research services; research, engineering, design and development of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; foundry services related to design of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; engineering project management services; management of scientific research projects; project management (design); research, engineering, design and development of microelectronic devices; design services for others; design of electric circuit boards; analysis of materials; industrial analysis; laboratory services; laboratory services (scientific research or analysis); materials characterisation analysis; technological engineering analysis; technological analysis services; scientific and technical analysis; management of testing, packaging and assembly services; prototyping services; research, engineering, design and development of light emitting diodes (LED); testing of semiconductor materials and devices; technical project research of semiconductor materials and devices; research and development of semiconductor materials and devices; engineering service in the field of semiconductor materials and devices; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices; consultancy, assistance, advisory and information services (including online, interactive, digital and datacasting services) in relation to the foregoing
Scientific and technological services and research and design relating thereto; industrial analysis and research services; research, engineering, design and development of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; foundry services related to design of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; engineering project management services; management of scientific research projects; project management (design); research, engineering, design and development of microelectronic devices; design services for others; design of electric circuit boards; analysis of materials; industrial analysis; laboratory services; laboratory services (scientific research or analysis); materials characterisation analysis; technological engineering analysis; technological analysis services; scientific and technical analysis; management of testing, packaging and assembly services; prototyping services; research, engineering, design and development of light emitting diodes (LED); testing of semiconductor materials and devices; technical project research of semiconductor materials and devices; research and development of semiconductor materials and devices; engineering service in the field of semiconductor materials and devices; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices; consultancy, assistance, advisory and information services (including online, interactive, digital and datacasting services) in relation to the foregoing