Trademark: FILTRONIC 2322048
Word
FILTRONIC
Device Descrption:
ELELCTRONIC WAVE IN DISC
ID
2322048
Trademark Type
Figurative
Status
Protected: Registered/protected
Application Date
15 June 2022
Registration Date
15 June 2022
Renewal Date
15 June 2032
Owner(s)
Service
Goods and Services:
Class 9:
Antennas; antennae filters; amplifiers, electronic, magnetic, microwave, optical interference and radio frequency filters; coaxial cables incorporating filters; filters for radio interference suppression; fixed electronic signal filters; optical filters capable of controlling transmission rate of signals; semiconductors; electronic or electric circuits; components for electric or electronic circuits; computer based apparatus for designing the layout of electronic circuits; computer based development apparatus for testing electronic circuits; connectors for electronic circuits; apparatus for testing electronic circuits; electronic chips for the manufacture of integrated circuits; electronic control circuits; apparatus for testing electronic circuits; printed electronic circuits for apparatus and cards bearing integrated circuits; optical, radio, satellite, data communications, electrical, transmitter and radio frequency receivers; radar receivers for use with weapons systems; radar receivers with amplifiers; receivers for frequency modulated signals; wave receivers adapted for use with microwaves; analogue to digital converters; converters for analogue and digital signals; digital to analogue converters; electrical, frequency and process signal converters; digital, electric, electronic, optical and signal amplifiers; antennas for wireless communications apparatus; wireless apparatus and instruments; wireless high frequency transmission instruments; wireless transmitters and wireless transmission apparatus; wireless receiving apparatus; microwave antennae; microwave components, connectors, detectors and filters; microwave communications apparatus; optical cables; cables for optical signal transmission; connections for use with optical fibre cables and optical detectors and transmitters for use with fibre optic cable; broadband data interconnecting computer installations; high capacity broadband telecommunication switching apparatus; circulators in the nature of electronic components; duplexers and multiplexers; equalisers and oscillators; frequency synthesizers; process signal isolators; cellular mobile telephones and cellular telecommunications apparatus; telecommunications apparatus and instruments for use in cellular radio networks; transceivers; embedded computer hardware; embedded computer software; parts and fittings for all the aforesaid goods; none being chemical substances or chemical preparations for use in the manufacture of semi-conductors, doped or undoped, polycrystalline and monocrystalline inorganic semi-conductor material for use in the manufacture of semi-conductors, unprocessed silicon wafers including heat treated argon-annealed wafers which are otherwise unprocessed and hyperpure silicon used as substrate for semiconductor device manufacturing (excluding wafers and substrates resulting from epitaxial processing and any substrates, preparation or material that have been specifically manipulated at the nanoscale level).
Antennas; antennae filters; amplifiers, electronic, magnetic, microwave, optical interference and radio frequency filters; coaxial cables incorporating filters; filters for radio interference suppression; fixed electronic signal filters; optical filters capable of controlling transmission rate of signals; semiconductors; electronic or electric circuits; components for electric or electronic circuits; computer based apparatus for designing the layout of electronic circuits; computer based development apparatus for testing electronic circuits; connectors for electronic circuits; apparatus for testing electronic circuits; electronic chips for the manufacture of integrated circuits; electronic control circuits; apparatus for testing electronic circuits; printed electronic circuits for apparatus and cards bearing integrated circuits; optical, radio, satellite, data communications, electrical, transmitter and radio frequency receivers; radar receivers for use with weapons systems; radar receivers with amplifiers; receivers for frequency modulated signals; wave receivers adapted for use with microwaves; analogue to digital converters; converters for analogue and digital signals; digital to analogue converters; electrical, frequency and process signal converters; digital, electric, electronic, optical and signal amplifiers; antennas for wireless communications apparatus; wireless apparatus and instruments; wireless high frequency transmission instruments; wireless transmitters and wireless transmission apparatus; wireless receiving apparatus; microwave antennae; microwave components, connectors, detectors and filters; microwave communications apparatus; optical cables; cables for optical signal transmission; connections for use with optical fibre cables and optical detectors and transmitters for use with fibre optic cable; broadband data interconnecting computer installations; high capacity broadband telecommunication switching apparatus; circulators in the nature of electronic components; duplexers and multiplexers; equalisers and oscillators; frequency synthesizers; process signal isolators; cellular mobile telephones and cellular telecommunications apparatus; telecommunications apparatus and instruments for use in cellular radio networks; transceivers; embedded computer hardware; embedded computer software; parts and fittings for all the aforesaid goods; none being chemical substances or chemical preparations for use in the manufacture of semi-conductors, doped or undoped, polycrystalline and monocrystalline inorganic semi-conductor material for use in the manufacture of semi-conductors, unprocessed silicon wafers including heat treated argon-annealed wafers which are otherwise unprocessed and hyperpure silicon used as substrate for semiconductor device manufacturing (excluding wafers and substrates resulting from epitaxial processing and any substrates, preparation or material that have been specifically manipulated at the nanoscale level).
Class 37:
Installation, repair and maintenance of electronic and telecommunications apparatus and instruments, antennas, amplifiers, filters, semiconductors, optical cables, integrated circuits, receivers, transceivers, wireless apparatus and instruments, parts and fittings; none of the aforesaid services being offered in relation to chemical substances or chemical preparations for use in the manufacture of semi-conductors, doped or undoped, polycrystalline and monocrystalline inorganic semi-conductor material for use in the manufacture of semi-conductors, unprocessed silicon wafers including heat treated argon-annealed wafers which are otherwise unprocessed and hyperpure silicon used as substrate for semiconductor device manufacturing (excluding wafers and substrates resulting from epitaxial processing and any substrates, preparation or material that have been specifically manipulated at the nanoscale level).
Installation, repair and maintenance of electronic and telecommunications apparatus and instruments, antennas, amplifiers, filters, semiconductors, optical cables, integrated circuits, receivers, transceivers, wireless apparatus and instruments, parts and fittings; none of the aforesaid services being offered in relation to chemical substances or chemical preparations for use in the manufacture of semi-conductors, doped or undoped, polycrystalline and monocrystalline inorganic semi-conductor material for use in the manufacture of semi-conductors, unprocessed silicon wafers including heat treated argon-annealed wafers which are otherwise unprocessed and hyperpure silicon used as substrate for semiconductor device manufacturing (excluding wafers and substrates resulting from epitaxial processing and any substrates, preparation or material that have been specifically manipulated at the nanoscale level).
Class 42:
Design of integrated circuits and design services relating to integrated circuits; services for the hire of apparatus used in the design of integrated circuits; testing of filters; computer aided design services; computer programming services; consultancy, research, development and design services all relating to electronic apparatus and instruments and, amplifiers, filters, semiconductors, optical cables, integrated circuits, receivers, transceivers, parts and fittings; technical research and materials testing; none of the aforesaid services being offered in relation to chemical substances or chemical preparations for use in the manufacture of semi-conductors, doped or undoped, polycrystalline and monocrystalline inorganic semi-conductors material for use in the manufacture of semi-conductors, unprocessed silicon wafers including heat treated argon-annealed wafers which are otherwise unprocessed and hyperpure silicon used as substrate for semiconductor device manufacturing (excluding wafers and substrates resulting from epitaxial processing and any substrates, preparations or materials that have been specifically manipulated at the nanoscale level).
Design of integrated circuits and design services relating to integrated circuits; services for the hire of apparatus used in the design of integrated circuits; testing of filters; computer aided design services; computer programming services; consultancy, research, development and design services all relating to electronic apparatus and instruments and, amplifiers, filters, semiconductors, optical cables, integrated circuits, receivers, transceivers, parts and fittings; technical research and materials testing; none of the aforesaid services being offered in relation to chemical substances or chemical preparations for use in the manufacture of semi-conductors, doped or undoped, polycrystalline and monocrystalline inorganic semi-conductors material for use in the manufacture of semi-conductors, unprocessed silicon wafers including heat treated argon-annealed wafers which are otherwise unprocessed and hyperpure silicon used as substrate for semiconductor device manufacturing (excluding wafers and substrates resulting from epitaxial processing and any substrates, preparations or materials that have been specifically manipulated at the nanoscale level).