Trademark: SPS SEMICONDUCTOR PRODUCTION SYSTEMS 2302434
Word
SPS SEMICONDUCTOR PRODUCTION SYSTEMS
Device Descrption:
2 ARCS AROUND LTRS
ID
2302434
Trademark Type
FIGURATIVE
Status
Accepted: In opposition period
Application Date
04 April 2022
Owner(s)
Service
Kodomo Enterprises Pty Ltd
Goods and Services:
Class 7:
Machines and apparatus for coating, cleaning and packaging of semiconductors, integrated circuits and printed circuit; spin-coaters, namely machines to spread uniform films on flat substrates by centrifugal force; wafer edge grinders; cleaning and drying machines for semiconductor wafer carriers and container boxes for holding wafer carriers and wafers.
Machines and apparatus for coating, cleaning and packaging of semiconductors, integrated circuits and printed circuit; spin-coaters, namely machines to spread uniform films on flat substrates by centrifugal force; wafer edge grinders; cleaning and drying machines for semiconductor wafer carriers and container boxes for holding wafer carriers and wafers.
Class 9:
Semiconductors; integrated circuits; optical and electronic apparatus for testing electronic, micromechanical and optomechanical components; sputter coaters for electron microscopy sample preparation; computer hardware; computer software.
Semiconductors; integrated circuits; optical and electronic apparatus for testing electronic, micromechanical and optomechanical components; sputter coaters for electron microscopy sample preparation; computer hardware; computer software.
Class 11:
Apparatus and installations for heating and cooling purposes; thermal evaporator machines; drying machines for semiconductor wafer carriers and container boxes for holding wafer carriers and wafers; wet process systems for electrochemical deposition and surface preparation applications, namely, drying apparatus for chemical processing; wafer transporters and reactors, photoresist processors, namely, hot plate ovens for heating a silicon wafer.
Apparatus and installations for heating and cooling purposes; thermal evaporator machines; drying machines for semiconductor wafer carriers and container boxes for holding wafer carriers and wafers; wet process systems for electrochemical deposition and surface preparation applications, namely, drying apparatus for chemical processing; wafer transporters and reactors, photoresist processors, namely, hot plate ovens for heating a silicon wafer.
Class 20:
Packaging containers of wood or plastic; containers, not of metal, for storage or transport; wafer shipping box; transport pallets, not of metal.
Packaging containers of wood or plastic; containers, not of metal, for storage or transport; wafer shipping box; transport pallets, not of metal.
Class 37:
Installation of industrial machinery; semiconductor wafer machinery installation; spin coater machinery installation; restoration, repair and maintenance of semiconductor wet processing equipment and spin coaters; and the re-manufacture and restoration of refurbished owned semiconductor wet processing equipment and spin coaters; wet clean upgrades, namely services for semiconductor wet cleaning and wafer cleaning.
Installation of industrial machinery; semiconductor wafer machinery installation; spin coater machinery installation; restoration, repair and maintenance of semiconductor wet processing equipment and spin coaters; and the re-manufacture and restoration of refurbished owned semiconductor wet processing equipment and spin coaters; wet clean upgrades, namely services for semiconductor wet cleaning and wafer cleaning.
Class 40:
Custom wafer polishing services; custom manufacture of spin coaters, wafer equipment, wafer automation and wet bench automation.
Custom wafer polishing services; custom manufacture of spin coaters, wafer equipment, wafer automation and wet bench automation.
Class 42:
Electrical and mechanical engineering services; artificial intelligence design and development services in the field of silicon wafers, wafer automation, semiconductors, thin-films, spin-coaters; consulting services in the field of design of measurement systems, wet process equipment and apparatus, thermal evaporator systems, atomic layer deposition systems, photolithography systems; design and development of computer software in the field of wafer machinery management and optimisation.
Electrical and mechanical engineering services; artificial intelligence design and development services in the field of silicon wafers, wafer automation, semiconductors, thin-films, spin-coaters; consulting services in the field of design of measurement systems, wet process equipment and apparatus, thermal evaporator systems, atomic layer deposition systems, photolithography systems; design and development of computer software in the field of wafer machinery management and optimisation.