Trademark: ATOMIC MACHINES 2255152
Word
ATOMIC MACHINES
ID
2255152
Trademark Type
Word
Status
Protected: Registered/protected
Application Date
23 November 2021
Registration Date
23 November 2021
Renewal Date
23 November 2031

Service
AJ Park

Goods and Services:
Class 9:
Prototype parts for product development employing micro electro-mechanical systems (MEMS) and other micro-scale and meso-scale technology, namely, MEMS electrical relays, MEMS circuit breakers, MEMS current sensors, MEMS microphones, MEMS speakers, MEMS photomultipliers, MEMS signal mirrors for beam steering, microfluidic flow cells, namely, flow-based analyzers for scientific or laboratory use; microfluidic chips, micro-scale electrical connectors, micro-scale electromagnetic coils, micro-scale magnetic and electromagnetic actuators, micro-scale magnetic field measurement devices and structural parts therefore; products for the supply and delivery of electricity and other forms of power and energy, namely, MEMS electrical relays, MEMS circuit breakers, MEMS current sensors, MEMS microphones, MEMS speakers, MEMS photomultipliers, MEMS signal mirrors for beam steering, microfluidic flow cells, namely, flow-based analyzers for scientific or laboratory use, microfluidic chips, micro-scale electrical connectors, micro-scale electromagnetic coils, micro-scale magnetic and electromagnetic actuators, micro-scale magnetic field measurement devices; optical devices and components, namely, light emitting diodes (LEDs), lasers not for medical use, plasma light sources, optical sensors, optical lenses, and optical mirrors; optical devices and components, namely, optical windows composed of sapphire, glass, borosilicate glass, diamond, zinc selenide, quartz, silicon, polymer, or germanium for use as components of MEMS; acoustic devices, namely, MEMS microphones, MEMS speakers; sensors, namely, electro-mechanical current sensors; electrical transducers; resonators; actuators, namely, magnetic and electromagnetic actuators; downloadable computer software for designing and controlling manufacturing of MEMS electrical relays, MEMS circuit breakers, MEMS current sensors, MEMS microphones, MEMS speakers, MEMS photomultipliers, MEMS mirrors for beam steering, microfluidic flow cells, m; icrofluidic chips, micro-scale electrical connectors, micro-scale electromagnetic coils, micro-scale magnetic and electromagnetic actuators, micro-scale magnetic field measurement devices.
Class 40:
Custom additive and subtractive manufacturing for others; prototype fabrication of new products for others; laser processing of materials; laser processing of metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; laser marking of materials; laser marking of metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; treatment of materials by means of liquid adhesive bonding; treatment of materials by means of liquid adhesive bonding of metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; treatment of materials by means of adhesive film bonding; treatment of materials by means of adhesive film bonding of metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; eutectic bonding services, namely, soldering and brazing; eutectic bonding services, namely, soldering and brazing of metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; Electroplating; Electroplating of metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; electroless plating of metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; application of coatings using plasma spraying techniques; application of coatings using plasma spraying techniques for metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; sputtering of metals and ceramics; sputtering of metals and ceramic on to metals, ceramics, polymers, glasses, composites, minerals, and semiconductors; laser welding of metals; laser joining of glasses and ceramics; custom manufacture of electronic assemblies, clinical diagnostic equipment, medical apparatus and instruments, and semiconductor components with magnets, microchips, micro-LEDs, metal wires, and materials, namely metals, ceramics, polymers, glasses, composites, minerals, and semiconductors, by means of pick-and-place assembly, the materials being processed by laser processing, laser marking, liquid adhesive bo; nding, adhesive film bonding, soldering, brazing, electroplating, electroless plating, plasma spraying, and sputtering of metal and ceramics; custom manufacturing services for others in the fields of MEMS, micro-connectors, microfluidics, micro-gears, micro-springs; manufacturing process consultation services.