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Trademark
Owner
Trademark: ONSEMI 2246210
Word
ONSEMI
Device Descrption:
TRIANGLE,RIGHT-ANGLED IS PART OF LTR I,BROKEN
ID
2246210
Trademark Type
Figurative
Status
Protected: Registered/protected
Application Date
05 October 2021
Registration Date
05 October 2021
Renewal Date
05 October 2031
Owner(s)
Semiconductor Components Industries, LLC
Service
Goods and Services:
Class 9
:
Semiconductors
;
integrated circuits
;
microchips
;
microprocessors
;
sensors, namely, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, and sensors for determining position
;
semiconductor parts, namely, semiconductor packaging
;
semiconductor parts, namely, semiconductor chips and semiconductor lead frames
;
downloadable software for the operation of semiconductors, integrated circuits, microchips, microprocessors, image sensors, ultrasonic sensors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position sensors, and semiconductor parts being semiconductor chips, semiconductor lead frames, and semiconductor packaging.
Class 40
:
Custom manufacture of semiconductors, integrated circuits, microchips, microprocessors, image sensors, ultrasonic sensors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging.
Class 42
:
Design of semiconductors, integrated circuits, microchips, microprocessors, image sensors, ultrasonic sensors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging
;
development of software for the operation of semiconductors and semiconductor parts
;
providing temporary use of online non-downloadable software for the operation of semiconductors, integrated circuits, microchips, microprocessors, image sensors, ultrasonic sensors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging.