Trademark: POLOS 2198446
Word
POLOS
ID
2198446
Trademark Type
Word
Status
Protected: Registered/protected
Application Date
28 January 2021
Registration Date
28 January 2021
Renewal Date
28 January 2031
Owner(s)
Service
Goods and Services:
Class 7:
Machines and apparatus for manufacturing, customizing, (lithographic) treatment, coating, cleaning, printing and packaging of semiconductors, integrated circuits and printed circuit; machines and precision engineering apparatus for manufacturing and processing electronic, micromechanical and optical components; spin coaters; hotplates (lithographic hot plates) being parts of machines; dispensing pumps; direct laser writing devices (lithographic printing machines); LED imprinting machines (UV printing machines); optical, electric and electronic machines for manufacturing and processing electronic, micromechanical and optomechanical components, mainly semiconductor and micromechanical components, in particular mask adjustment apparatus, wafer samplers, bonders, coaters, including linked systems.
Machines and apparatus for manufacturing, customizing, (lithographic) treatment, coating, cleaning, printing and packaging of semiconductors, integrated circuits and printed circuit; machines and precision engineering apparatus for manufacturing and processing electronic, micromechanical and optical components; spin coaters; hotplates (lithographic hot plates) being parts of machines; dispensing pumps; direct laser writing devices (lithographic printing machines); LED imprinting machines (UV printing machines); optical, electric and electronic machines for manufacturing and processing electronic, micromechanical and optomechanical components, mainly semiconductor and micromechanical components, in particular mask adjustment apparatus, wafer samplers, bonders, coaters, including linked systems.
Class 9:
Integrated circuits; semiconductors; optical, electric and electronic apparatus for testing electronic, micromechanical and optomechanical components, mainly semiconductor and micromechanical components, in particular mask adjustment apparatus, wafer samplers, bonders, coaters, including linked systems; photographic and cinematographic apparatus for use in thin layer characterisation techniques; mask-aligner (optical apparatus); machines and precision engineering apparatus for testing electronic, micromechanical and optical components.
Integrated circuits; semiconductors; optical, electric and electronic apparatus for testing electronic, micromechanical and optomechanical components, mainly semiconductor and micromechanical components, in particular mask adjustment apparatus, wafer samplers, bonders, coaters, including linked systems; photographic and cinematographic apparatus for use in thin layer characterisation techniques; mask-aligner (optical apparatus); machines and precision engineering apparatus for testing electronic, micromechanical and optical components.