Trademark: 1907255
Word
Device Descrption:
2 ATOMIC-ORBITS IN 2 CURVED STRIPES
ID
1907255
Trademark Type
Figurative
Status
Registered: Registered/protected
Application Date
15 February 2018
Registration Date
15 February 2018
Renewal Date
15 February 2028
Owner(s)
Service
Griffith Hack
Goods and Services:
Class 9:
Integrated circuits, electric circuits; displays, namely, plasma displays, consumer electronics displays; photo masks, for etching silicon wafers; apparatus for semiconductor package and tests, namely, apparatus for semiconductor assembly, probing and final tests; semiconductors, semiconductor devices, namely, memory modules, dynamic random access memory, static random access memory, non-volatile memory, logic devices, embedded devices, electrical controllers for consumer electronics displays and electrical controllers for plasma displays; microprocessor chips, floating point arithmetic computer chips, ultra large scale integrated circuits, namely, motion picture expert group (mpeg) chips, digital signal processor chips, computer peripheral control chips, communication control chips, integrated circuits for games and stand-alone electronic games comprising arithmetic chips, integrated circuits for consumer electronics, and compression or decompression computer chips; silicon chips, silicon wafers and silicon wafer slices; liquid crystal displays (LCDs)
Integrated circuits, electric circuits; displays, namely, plasma displays, consumer electronics displays; photo masks, for etching silicon wafers; apparatus for semiconductor package and tests, namely, apparatus for semiconductor assembly, probing and final tests; semiconductors, semiconductor devices, namely, memory modules, dynamic random access memory, static random access memory, non-volatile memory, logic devices, embedded devices, electrical controllers for consumer electronics displays and electrical controllers for plasma displays; microprocessor chips, floating point arithmetic computer chips, ultra large scale integrated circuits, namely, motion picture expert group (mpeg) chips, digital signal processor chips, computer peripheral control chips, communication control chips, integrated circuits for games and stand-alone electronic games comprising arithmetic chips, integrated circuits for consumer electronics, and compression or decompression computer chips; silicon chips, silicon wafers and silicon wafer slices; liquid crystal displays (LCDs)
Class 35:
Import and export agencies for semiconductors, wafers and integrated circuits, and semiconductor manufacturing equipment; providing business information in the field of establishing and operating semiconductors, wafers and integrated circuit businesses; computerized on-line retail services via the global communication network providing Chinese input and display units, chips, negative masks, network cards, circuit boards, semiconductors, interface cards for the computer, micro computers, integrated circuits, printed circuit boards, laminates, integrated circuit pins; computerized on-line retail services via the global communication network providing computers and computer peripherals
Import and export agencies for semiconductors, wafers and integrated circuits, and semiconductor manufacturing equipment; providing business information in the field of establishing and operating semiconductors, wafers and integrated circuit businesses; computerized on-line retail services via the global communication network providing Chinese input and display units, chips, negative masks, network cards, circuit boards, semiconductors, interface cards for the computer, micro computers, integrated circuits, printed circuit boards, laminates, integrated circuit pins; computerized on-line retail services via the global communication network providing computers and computer peripherals
Class 39:
Packaging wafers, chips, semiconductors and integrated circuits to the order and specification of others, packaging of masks to the order and specification of others
Packaging wafers, chips, semiconductors and integrated circuits to the order and specification of others, packaging of masks to the order and specification of others
Class 40:
Custom assembly for others of wafers, chips, semiconductors andintegrated circuits; Custom assembly for others of integrated circuits, masks, and electronic chips or computer chips; custom cutting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom photo lithograph printing of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom etching of wafers, chips, semiconductors and integrated circuits; custom thin filming of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom diffusion ion implanting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom chemical mechanical polishing of wafers, chips, semiconductors and integrated circuits to the order and specification of others
Custom assembly for others of wafers, chips, semiconductors andintegrated circuits; Custom assembly for others of integrated circuits, masks, and electronic chips or computer chips; custom cutting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom photo lithograph printing of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom etching of wafers, chips, semiconductors and integrated circuits; custom thin filming of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom diffusion ion implanting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom chemical mechanical polishing of wafers, chips, semiconductors and integrated circuits to the order and specification of others