Trademark: LIDE 1858882
Word
LIDE
ID
1858882
Trademark Type
Word
Status
Protected: Registered/protected
Application Date
19 April 2017
Registration Date
19 April 2017
Renewal Date
19 April 2027
Owner(s)
Service
Refer to WIPO address for Correspondence
Goods and Services:
Class 7:
Machinery and mechanically operated equipment for laser treatment; machinery and mechanically operated equipment for etching of laser-structured or laser-modified substrates; mechanical treatment plants for laser-structured or laser-modified substrates
Machinery and mechanically operated equipment for laser treatment; machinery and mechanically operated equipment for etching of laser-structured or laser-modified substrates; mechanical treatment plants for laser-structured or laser-modified substrates
Class 9:
Lasers, not for medical purposes; electric circuit boards, electric sensors, electronic or electric circuits, semiconductors, semiconductor chips; semiconductor elements, process control apparatus (electric), process control instruments (electric), relays (electric), lasers for laser structuring or laser modifying of substrates, lasers for drilling of shaped bores and contour cutting in transparent substrates
Lasers, not for medical purposes; electric circuit boards, electric sensors, electronic or electric circuits, semiconductors, semiconductor chips; semiconductor elements, process control apparatus (electric), process control instruments (electric), relays (electric), lasers for laser structuring or laser modifying of substrates, lasers for drilling of shaped bores and contour cutting in transparent substrates
Class 40:
Treatment of materials for electronic components, circuit boards, materials, circuit carriers, granules, additives and unprocessed plastics using lasers, namely laser treatment and laser structuring; laser treatment for microstructures, shaped micro-bores and micro-contour cuttings and in transparent components made of glass; laser modification and laser structuring of substrates and transparent components; implementation of etching methods on laser-structured and laser-modified substrates and components
Treatment of materials for electronic components, circuit boards, materials, circuit carriers, granules, additives and unprocessed plastics using lasers, namely laser treatment and laser structuring; laser treatment for microstructures, shaped micro-bores and micro-contour cuttings and in transparent components made of glass; laser modification and laser structuring of substrates and transparent components; implementation of etching methods on laser-structured and laser-modified substrates and components