Trademark: DIRECT PRESSED DIE TECHNOLOGY 1818847
Word
DIRECT PRESSED DIE TECHNOLOGY
Device Descrption:
CHEVRON ATOP HORIZONTAL STRIPE
ID
1818847
Trademark Type
Figurative
Status
Protected: Registered/protected
Application Date
26 July 2016
Registration Date
26 July 2016
Renewal Date
26 July 2026
Owner(s)
Service
Refer to WIPO address for Correspondence
Goods and Services:
Class 9:
Electronic components; power transformers; voltage converters; voltage regulators; semiconductor devices; semiconductor components, particularly discrete and integrated semiconductor devices; transistors, particularly bipolar transistors; field-effect transistors and power transistors; diodes, particularly power diodes; thyristors, particularly power thyristors; power semiconductor modules; power semiconductor modules with power semiconductor components; power semiconductor modules with pressure device for electrical contacting of substrates; connecting elements and power semiconductor devices; power semiconductor modules with printing devices for thermal bonding of substrates, connecting elements and power semiconductor devices; unit converters with power semiconductor modules, with other electrical and electronic components and power converter systems built from these unit converters
Electronic components; power transformers; voltage converters; voltage regulators; semiconductor devices; semiconductor components, particularly discrete and integrated semiconductor devices; transistors, particularly bipolar transistors; field-effect transistors and power transistors; diodes, particularly power diodes; thyristors, particularly power thyristors; power semiconductor modules; power semiconductor modules with power semiconductor components; power semiconductor modules with pressure device for electrical contacting of substrates; connecting elements and power semiconductor devices; power semiconductor modules with printing devices for thermal bonding of substrates, connecting elements and power semiconductor devices; unit converters with power semiconductor modules, with other electrical and electronic components and power converter systems built from these unit converters