Trademark: LEADING THE PACK 1805274
Word
LEADING THE PACK
ID
1805274
Trademark Type
Word
Status
Cancelled: Cancelled at the request of IB
Application Date
01 March 2016
Cancellation Date
13 August 2021
Owner(s)
Service
Goods and Services:
Class 9:
Integrated circuits; microwave generating devices for industrial use, transistors; diodes; semiconductor devices; semiconductor chips; radio frequency (RF) devices; power switching devices; semiconductor wafers, materials and devices composed of silicon carbide and gallium nitride
Integrated circuits; microwave generating devices for industrial use, transistors; diodes; semiconductor devices; semiconductor chips; radio frequency (RF) devices; power switching devices; semiconductor wafers, materials and devices composed of silicon carbide and gallium nitride
Class 40:
Customized materials assembly for others; custom manufacture of radio frequency in microwave devices and components; custom manufacture of transistors; custom manufacture of wireless communication components; custom manufacture of amplifiers; custom manufacture of lateral diffused metal oxide semiconductors (LDMOS); custom manufacture of metal semiconductor field effect transistors (MESFETS); custom manufacture of components formatted for the worldwide interoperability for microwave access (WiMax) standard; custom manufacturing services for others in the field of semiconductor devices
Customized materials assembly for others; custom manufacture of radio frequency in microwave devices and components; custom manufacture of transistors; custom manufacture of wireless communication components; custom manufacture of amplifiers; custom manufacture of lateral diffused metal oxide semiconductors (LDMOS); custom manufacture of metal semiconductor field effect transistors (MESFETS); custom manufacture of components formatted for the worldwide interoperability for microwave access (WiMax) standard; custom manufacturing services for others in the field of semiconductor devices
Class 42:
Testing of semiconductor materials and devices; technical project research of semiconductor materials and devices; research and development of semiconductor materials and devices for others; engineering service in the field of semiconductor materials and devices; design of radio frequency and microwave devices and components, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access (WiMax) standard
Testing of semiconductor materials and devices; technical project research of semiconductor materials and devices; research and development of semiconductor materials and devices for others; engineering service in the field of semiconductor materials and devices; design of radio frequency and microwave devices and components, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access (WiMax) standard