Trademark: ADWILL 1628348
Word
ADWILL
ID
1628348
Trademark Type
Fancy
Status
Registered: Registered/protected
Application Date
13 June 2014
Registration Date
13 June 2014
Renewal Date
13 June 2034
Owner(s)
Service
Griffith Hack
Goods and Services:
Class 7:
Metal working machinery and appliances; semiconductor manufacturing machines and systems; machines for dicing semiconductor wafers into chips by blade, by means of laser; grinding machines for use in semiconductor manufacturing process; UV irradiation machines, electron beam irradiation machines, and energy line irradiation machines, all being for use in semiconductor manufacturing process; machines for adhering surface protection tapes, machines for adhering backside protection tape, both being for use in semiconductor manufacturing process; machines for releasing surface protection tape, machines for releasing backside protection tape, both being for use in semiconductor manufacturing process; machines for issuing and adhering, for reading, and for writing bar code label and radio frequency identification (RFID) label, all being for use in semiconductor manufacturing process; metal working machinery and appliances comprising cutting machines for semiconductor wafers, tape adhering machines, grinding machines, transporting machines and tape replacing machines; semiconductor wafer processing machines and parts thereof; semiconductor wafer washing machines; feeding machines, transferring machines, and storing machines, all for semiconductor wafers; machines for exchanging wafers among semiconductor wafer containers; heating machines, pressurizing machines for processing semiconductor wafers; cutting machines, and punching machines, both being for use in semiconductor wafer processing tapes; machines for picking up diced semiconductor chips; printing/book making machines and appliances; wrapping machines and appliances; automatic labeling machines and appliances; other labeling machines and appliances
Metal working machinery and appliances; semiconductor manufacturing machines and systems; machines for dicing semiconductor wafers into chips by blade, by means of laser; grinding machines for use in semiconductor manufacturing process; UV irradiation machines, electron beam irradiation machines, and energy line irradiation machines, all being for use in semiconductor manufacturing process; machines for adhering surface protection tapes, machines for adhering backside protection tape, both being for use in semiconductor manufacturing process; machines for releasing surface protection tape, machines for releasing backside protection tape, both being for use in semiconductor manufacturing process; machines for issuing and adhering, for reading, and for writing bar code label and radio frequency identification (RFID) label, all being for use in semiconductor manufacturing process; metal working machinery and appliances comprising cutting machines for semiconductor wafers, tape adhering machines, grinding machines, transporting machines and tape replacing machines; semiconductor wafer processing machines and parts thereof; semiconductor wafer washing machines; feeding machines, transferring machines, and storing machines, all for semiconductor wafers; machines for exchanging wafers among semiconductor wafer containers; heating machines, pressurizing machines for processing semiconductor wafers; cutting machines, and punching machines, both being for use in semiconductor wafer processing tapes; machines for picking up diced semiconductor chips; printing/book making machines and appliances; wrapping machines and appliances; automatic labeling machines and appliances; other labeling machines and appliances
Class 9:
Bar code printers; thermal transfer printers; laser printers; ink jet printers; thermal printers; printers; applied electronic machines and appliances (excluding Geiger counters, high-frequency sewing-machines, cyclotrons, X-ray machines and appliances for industrial purposes, betatrons for industrial purposes, magnetic prospecting machines and appliances, magnetic detecting machines and appliances, seismic detecting machines and appliances, hydrophonic machines and appliances, ultrasonic depth sounders, ultrasonic flaw detectors, ultrasonic detecting machines and appliances, electronically applied automatic door opening-closing machines and appliances, electronic microscopes); programs for electronic calculators; frames adapted to carry semi-conductor wafers for use in semiconductor wafer processing work; storing containers, transferring containers, and transporting containers, all adapted to carry semi-conductor wafers and all for use in processing semiconductor wafers; storing containers, transferring containers, and transporting containers, all adapted to carry semiconductor wafers and all for use with frames to be used in processing semiconductor wafers
Bar code printers; thermal transfer printers; laser printers; ink jet printers; thermal printers; printers; applied electronic machines and appliances (excluding Geiger counters, high-frequency sewing-machines, cyclotrons, X-ray machines and appliances for industrial purposes, betatrons for industrial purposes, magnetic prospecting machines and appliances, magnetic detecting machines and appliances, seismic detecting machines and appliances, hydrophonic machines and appliances, ultrasonic depth sounders, ultrasonic flaw detectors, ultrasonic detecting machines and appliances, electronically applied automatic door opening-closing machines and appliances, electronic microscopes); programs for electronic calculators; frames adapted to carry semi-conductor wafers for use in semiconductor wafer processing work; storing containers, transferring containers, and transporting containers, all adapted to carry semi-conductor wafers and all for use in processing semiconductor wafers; storing containers, transferring containers, and transporting containers, all adapted to carry semiconductor wafers and all for use with frames to be used in processing semiconductor wafers
Class 16:
Addressing machines; ink ribbons for printing; case sealing machines for office use; letterpresses; multigraphs; dust-free paper; adhesive coated paper; paper; adhesive labels (not including those made of woven fabrics); heat-sensitive adhesive labels; heat-sensitive printing labels; adhesive tapes for stationery use; bar code labels, RFID labels; bar code labels, RFID labels, both being for physical distribution management; bar code labels, RFID labels, both being for production management; notebooks made of dust-free paper; stationery
Addressing machines; ink ribbons for printing; case sealing machines for office use; letterpresses; multigraphs; dust-free paper; adhesive coated paper; paper; adhesive labels (not including those made of woven fabrics); heat-sensitive adhesive labels; heat-sensitive printing labels; adhesive tapes for stationery use; bar code labels, RFID labels; bar code labels, RFID labels, both being for physical distribution management; bar code labels, RFID labels, both being for production management; notebooks made of dust-free paper; stationery
Class 17:
Plastic products in this class; plastic films coated with adhesives, with pressure-sensitive adhesives, and with adhesives/pressure-sensitive adhesives; adhesive tapes, pressure-sensitive adhesive tapes, adhesive tapes/pressure-sensitive adhesive tapes, all being for processing semiconductors; adhesive tapes, pressure-sensitive adhesive tapes, adhesive tapes/pressure-sensitive adhesive tapes, all being for holding in position semiconductors; processing tapes for processing semiconductor wafers; release tapes for releasing processing tapes for processing semiconductor wafers; adhesive tapes for surface-mounting/laminating semiconductor chips; heat-sensitive and pressure-sensitive adhesive tapes/heat-sensitive adhesive tapes for use in manufacturing electronic parts including semiconductor wafers and ceramic capacitors; protection tapes for protecting rear surfaces of semiconductor chips
Plastic products in this class; plastic films coated with adhesives, with pressure-sensitive adhesives, and with adhesives/pressure-sensitive adhesives; adhesive tapes, pressure-sensitive adhesive tapes, adhesive tapes/pressure-sensitive adhesive tapes, all being for processing semiconductors; adhesive tapes, pressure-sensitive adhesive tapes, adhesive tapes/pressure-sensitive adhesive tapes, all being for holding in position semiconductors; processing tapes for processing semiconductor wafers; release tapes for releasing processing tapes for processing semiconductor wafers; adhesive tapes for surface-mounting/laminating semiconductor chips; heat-sensitive and pressure-sensitive adhesive tapes/heat-sensitive adhesive tapes for use in manufacturing electronic parts including semiconductor wafers and ceramic capacitors; protection tapes for protecting rear surfaces of semiconductor chips