Trademark: ACCRETECH 1090271
Word
ACCRETECH
ID
1090271
Trademark Type
Word
Status
Registered: Registered/protected
Application Date
13 December 2005
Registration Date
13 December 2005
Renewal Date
13 December 2025
Owner(s)
Service
Goods and Services:
Class 7:
Apparatus and equipment for manufacturing semiconductors; wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, wafer dicing machines, chemical mechanical planarizers, wafer back grinder, wafer polish grinder; processing apparatus for semiconducter manufacturing; exposure apparatus for semiconductor manufacturing; and other semiconductor manufacturing equipment parts and fittings for all the aforesaid goods
Apparatus and equipment for manufacturing semiconductors; wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, wafer dicing machines, chemical mechanical planarizers, wafer back grinder, wafer polish grinder; processing apparatus for semiconducter manufacturing; exposure apparatus for semiconductor manufacturing; and other semiconductor manufacturing equipment parts and fittings for all the aforesaid goods
Class 9:
Measuring apparatus and instruments; machine control gauges, automatic measuring equipments, displacement sensors, electric micrometers, pneumatic micrometers, digital length measuring instruments, laser interference length measuring sensors, optical fibre laser interferometer measuring systems, surface texture measuring instruments, three-dimensional measuring instruments, surface texture and contour measuring instruments, contour measuring instruments, roundness measuring instruments, roundness and cylindrical/flat profile analysis equipment, co-ordinate measuring machines, data processing systems; wafer probing machines, prober network system, discrete device tester, automatic die selectors, wafer inspection system, defect detection apparatus and instruments for semiconductor manufacturing, wafer thickness measuring instruments, non contact flatness measuring instruments; parts and fitting for all the aforesaid goods
Measuring apparatus and instruments; machine control gauges, automatic measuring equipments, displacement sensors, electric micrometers, pneumatic micrometers, digital length measuring instruments, laser interference length measuring sensors, optical fibre laser interferometer measuring systems, surface texture measuring instruments, three-dimensional measuring instruments, surface texture and contour measuring instruments, contour measuring instruments, roundness measuring instruments, roundness and cylindrical/flat profile analysis equipment, co-ordinate measuring machines, data processing systems; wafer probing machines, prober network system, discrete device tester, automatic die selectors, wafer inspection system, defect detection apparatus and instruments for semiconductor manufacturing, wafer thickness measuring instruments, non contact flatness measuring instruments; parts and fitting for all the aforesaid goods